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AlSiC Optoelectronic Housing

Optoelectronic module is consistently developing toward smaller; more integrated and more efficient orientation, resulting in more heat production and greater heat concentration. AlSiC material has a matched coefficient of thermal Fadi AlSiC Optoelectronic Housingexpansion and still keep high thermal conductivity, coupled with its low cost, thus to provided the industry with a better package design option.

Fadi Optoelectronic Housings is designed to host optoelectronic converter and codec. The housing consists of a AlSiC base plate and welded kovar walls, top cover is also kovar material. Optoelectronic module manufacturer can utilize this housing with better performance and lower cost without any change to their original manufacture facilities.

In comparison with traditional W-Cu base plate plus kovar wall assembly, AlSiC assembly has better thermal conductivity, better compactness, lower cost and lighter weight. W-Cu composite, from its hard manufacturing process view point, is unable to achieve perfect compactness on its products. More seriously, you can only find the defect after gold plating process or worse, after optoelectronic device welding is over, leaving 10% to 20% module wasted. AlSiC material is made from infiltration process, which guarantees the even and high density of the material. Replace W-Cu with AlSiC will dramatically save cost.

AlSiC Advantages:

  • CTE likes ceramic's, compatible with die and substrate;
  • TC better than W-Cu and Al alloy;
  • Has strength of Cast Ion, ductility of 45# steel;
  • Weight of Aluminum, half weight of Titanium;

AlSiC was early used on radar on warplane to replace W-Cu. New assemblies achieved better performance on thermal dissipation, and 10kg of weight was cut from the total weight of a radar. AlSiC material thus gained attention.

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AlSiC Material Data

One key statistic of AlSiC products

Dome shape of AlSiC IGBT base plate